HCL Foxconn Lays Foundation For Chip Unit
Prime Minister Narendra Modi has laid the foundation stone for a major semiconductor manufacturing facility being set up by HCL and Foxconn in Uttar Pradesh, marking a significant step in India’s push to strengthen domestic chip production and reduce import dependence.
HCL Foxconn Semiconductor Unit In Uttar Pradesh
The project, valued at around ₹3,700 crore, is being developed as a joint venture between HCL Group and Foxconn. The facility will come up in the Yamuna Expressway Industrial Development Authority region in Greater Noida. It will function as an Outsourced Semiconductor Assembly and Test (OSAT) unit, focusing on packaging and testing semiconductor chips rather than full-scale fabrication. The plant is expected to begin operations in the coming years after phased construction and equipment installation.
Chip Manufacturing Capacity And Job Creation
The semiconductor unit is projected to generate thousands of direct and indirect employment opportunities once operational. It is designed to process up to 20,000 wafers per month and manufacture key components such as display driver integrated circuits used in smartphones, consumer electronics and automotive systems. The facility aims to enhance India’s electronics manufacturing ecosystem and reduce reliance on imported chip packaging services.
Boost To India Semiconductor Ecosystem
The foundation of the HCL Foxconn semiconductor unit aligns with the government’s broader semiconductor mission to build a resilient supply chain and attract global investment. Officials have stated that the project will help strengthen India’s position in the global semiconductor value chain and support growth in sectors such as artificial intelligence, electric vehicles and telecommunications.
